Mfg Part Number: QD2149H-2 | Alternate P/N: QD2149H2 | NSN : 5962-01-321-1949 |
NIIN : 013211949 | CAGE Code : 34649 | Manufacturer: Intel Corporation |
Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
If you are looking for Microcircuit Memory components with the NSN part QD2149H-2, we have your back at After Market Aviation Spares. The NSN 5962-01-321-1949 has been produced by Intel Corporation and is available for purchase on our website. If you want to learn more about this NSN part number QD2149H-2, we invite you to fill out our RFQ form. Once we receive the form, a dedicated expert from our team will reach out to you with a personalized quote within 15 minutes or less. At After Market Aviation Spares, our dedicated account managers are committed to helping you find the right products at the best prices available in the market.
We go the extra mile to provide you with high-caliber, high-performing products with every purchase. We are the only independent distributor in the country with a strict NO CHINA SOURCING pledge, and we only offer products, parts, and components from reliable manufacturers like Intel Corporation. Moreover, as part of the ASAP family, we operate as an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited company. Make us your strategic sourcing partner by starting the purchasing process for the NSN part QD2149H-2 with the CAGE Code 34649 and NSN 5962-01-321-1949 today.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-321-1949 Item Description: Microcircuit Memory | 5962 | 013211949 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Qd2149h-2 | 1 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABKW | OVERALL HEIGHT | 0.400 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 0.960 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.130 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND MONOLITHIC |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | RAM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-6 MIL-M-38510 |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 18 PRINTED CIRCUIT |
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